PCI Express® 3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users who wish to improve and optimize graphic performance, as well as have the latest technology available to them.
Larger Area for Heat Dissipation with The Revolutionary Ceramics-Coating Technology
Innovative ceramics effectively conducts heat away from the system. It replaces traditional anti-oxidant to dissipate heat better with its microscopic irregular surface and enlarged area. Better cooling leads to overall improvement in system stability.
Real Time Temp Detection and Heat Removal
The TUF Thermal Radar monitors temps in critical parts of the motherboard in real time, automatically adjusting fan speeds to make sure the system maintains high stability without overheating. It consists of multiple sensors for various components on the motherboard, giving users the ability to monitor each area, while increasing options for fan control housed inside the chassis. The Thermal Radar automatically calculates ideal fan speeds based on different parameters selected by users for each component, keeping everything cooler and longer lasting.